Syskey’s Atomic Layer Deposition (ALD) is a precise thin-film deposition technique that adds one atomic layer at a time, ensuring excellent control over film thickness. It can create uniform coatings on complex shapes and is suitable for depositing various materials like metals, oxides, and semiconductors. ALD produces high-quality, pure films with minimal defects and is scalable from research to industrial production. It’s widely used in semiconductor manufacturing, nanotechnology, and other advanced applications requiring precise coatings.
List of ALD:
- Thermal ALD
- Plasma ALD
Features:
- Precise Layering: Deposits one atomic layer at a time for high control over film thickness.
- Uniform Coatings: Ensures even coatings on complex surfaces.
- Wide Material Options: Can deposit metals, oxides, and semiconductors.
- High Quality: Produces pure films with minimal defects.
- Scalable: Suitable for both research and large-scale industrial production.
- Ideal for Advanced Applications: Used in semiconductors, nanotechnology, and more.
Applications:
- High-k gate oxides.
- Passivation of crystal silicon solar cells and OLED.
- MEMS.
- Nano-electronics.
- Coating of nano-porous structures.
- Optical functional films.
- Encapsulation