The SYSKEY Multi-Chamber Cluster Coating System is a setup where multiple vacuum chambers are connected through a central transfer chamber. This allows continuous processing of substrates without breaking the vacuum, reducing the risk of oxidation during deposition. Substrates and masks are transferred using load-locks or glove boxes. SYSKEY customizes the system to fit customer needs, integrating various processes like sputtering, etching, PECVD, evaporation, ALD, annealing, plasma cleaning, and cooling. It’s used in industries like FPD, electronics, solar cells, and semiconductors.
Features:
Chamber
- Flexible chamber sizes depend on substrate size and applications.
- An aluminum chamber with robot arm for transferring substrate between chambers.
Options
- Sputter.
- PECVD.
- Dry Etching.
- ALD/PEALD.
- Plasma Cleaning.
- Annealing.
- E-beam evaporator.
- Thermal Evaporator .
Applications:
- Semiconductor.
- Solar cell.
- LED.
- OLED.
- OPV.
- FPD.