Direct Laser Writing (DLW): The Dilase range from Kloe France is a series of advanced laser lithography systems designed for direct writing on substrates. This technology uses focused laser beams to directly create patterns and structures with high precision on various materials.
Models:
- Dilase 125 – Plug and Play direct laser writing equipment
- Dilase 250 – Tabletop laser lithography system
- Dilase 650 – Multifunction maskless lithography equipment
- Dilase 750 – Customisable direct laser writer
Features:
- High Precision: Utilizes focused laser beams for precise patterning at the micro and nanoscale.
- Versatile: Suitable for a wide range of materials including semiconductors, photonic devices, and thin films.
- Fast Prototyping: Enables rapid prototyping and direct patterning without the need for masks, making it efficient for research and development.
- Scalable: The technology supports both small-scale production and larger-volume applications, depending on the system configuration.
Applications:
- Microelectronics: Used for creating fine patterns in semiconductor devices, optical circuits, and microelectromechanical systems (MEMS).
- Photonic Devices: Useful for fabricating waveguides, gratings, and other photonic structures.
- Biomedical: Applied in the development of biosensors and other biomedical devices requiring high precision.
- Thin Film Technology: Used to pattern thin films for a variety of applications, including solar cells and displays.