The Dilase 3D is a high-resolution 3D lithographic laser system designed to work with a variety of substrates, offering advanced capabilities in direct laser writing.
Features:
- 3D Lithography: Capable of working in three dimensions, allowing for the creation of complex structures with high precision.
- Resolution: Standard resolution of 5µm, with an optional upgrade to 2µm for even finer detail.
- Substrate Compatibility: Works on various materials including semiconductors, glass, polymer, crystals, and thin films.
- Large Surface Area: Can handle substrates up to 100 x 100mm, providing flexibility for different project scales.
- Depth Capability: Capable of writing up to 50mm deep, offering the ability to create structures with significant vertical features.
Applications:
- Microelectronics: Ideal for the fabrication of 3D semiconductor structures, micro-electromechanical systems (MEMS), and 3D photonic devices.
- Biomedical Engineering: Useful for the production of biomaterials, biosensors, and 3D tissue engineering scaffolds.
- Material Science: Enables nanostructure fabrication and thin-film structuring for research and development.
- Optical Devices: Applied in the creation of 3D optical waveguides, lenses, and other photonic components.