To address the need for rapid experiments and space constraints, SYSKEY has developed compact equipment for 2-inch glass and wafer substrates, known as the “Mini Line.” This practical manufacturing system is designed for small-scale production, enabling the efficient production of a limited number of components. With its innovative vertical design, the Mini Line provides a new approach to research and development, meeting the expectations of researchers seeking a compact and efficient solution.
SYSKEY’s Mini Line system includes a range of advanced processes such as:
- Thermal systems, sputter systems, PECVD, PEALD, RIE, ICP-RIE, and E-beam.
- It offers precise control over process gases and the ability to monitor key parameters such as pressure and substrate temperature, ensuring the production of high-quality thin films.