Plasma etching is a process that uses plasma to etch patterns onto a substrate, typically for semiconductor and microelectronics fabrication. The plasma creates reactive ions or radicals that remove material from the surface, leaving behind a desired pattern.
List if thermal evaporator:
- In reactive ion etching (RIE)
- Inductively coupled plasma (ICP)
- Atomic layer etching (ALE)
- Microwave Plasma Systems
Features:
- Precise Patterning: Allows for high-resolution etching of intricate patterns.
- Material Versatility: Can be used on a variety of materials, including metals, semiconductors, and insulators.
- High Control: Provides precise control over etch depth and uniformity.
- Clean Process: Plasma etching is a dry process, which reduces contamination compared to wet etching methods.
- Scalable: Suitable for both R&D and mass production environments.
- Advanced Applications: Ideal for the production of microelectronics, MEMS devices, and other precision components.
Applications:
- Basic plasma research.
- Photo-resist etching.
- III-V compound semiconductors (GaAsn, InP, GaN).
- Si, SiO2, SiNx.
- MEMS.
- Metal, silicon, resist etching.
- Photoresist stripping
- Surface cleaning after the processes
- (photolithography, dry etching, wet etching)
- Surface cleaning after storage
- Removal of organic passivating layers
- Resist Descum process